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1

Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method

Cook, Chase, Sun, Zeyu, Demircan, Ertugrul, Shroff, Mehul D., Tan, Sheldon X.-D.

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2018

Language:

english

File:

PDF, 2.46 MB

english, 2018

2

[IEEE 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) - Austin, TX, USA (2018.3.19-2018.3.22)] 2018 IEEE International Conference on Microelectronic Test Structures (ICMTS) - Test structure design for model-based electromigration

Demircan, Ertugrul, Shroff, Mehul D., Lee, Hsun-Cheng

Year:

2018

Language:

english

File:

PDF, 1.29 MB

english, 2018

3

Attrition of precipitated iron Fischer-Tropsch catalysts

Dinesh S. Kalakkad, Mehul D. Shroff, Steve Köhler, Nancy Jackson, A.K. Datye

Journal:

Applied Catalysis A: General

Year:

1995

Language:

english

File:

PDF, 1.75 MB

english, 1995

4

The importance of passivation in the study of iron Fischer-Tropsch catalysts

Mehul D. Shroff, Abhaya K. Datye

Journal:

Catalysis Letters

Year:

1996

Language:

english

File:

PDF, 1.82 MB

english, 1996

5

[IEEE 2008 IEEE International Conference on Microelectronic Test Structure (ICMTS) - Edinburgh, UK (2008.03.24-2008.03.27)] 2008 IEEE International Conference on Microelectronic Test Structures - A novel biasing technique for addressable parametric arrays

Smith, Brad, Annamalai, Uma, Arriordaz, Alexandre, Kolagunta, Venkat, Schmidt, Jeff, Shroff, Mehul

Year:

2008

File:

PDF, 290 KB

2008

6

A Novel Biasing Technique for Addressable Parametric Arrays

Smith, Brad, Arriordaz, Alexandre, Kolagunta, Venkat, Schmidt, Jeff, Shroff, Mehul

Journal:

IEEE Transactions on Semiconductor Manufacturing

Year:

2009

Language:

english

File:

PDF, 1.71 MB

english, 2009

7

[IEEE 2014 International Conference on Microelectronic Test Structures (ICMTS) - Udine, Italy (2014.3.24-2014.3.27)] 2014 International Conference on Microelectronic Test Structures (ICMTS) - Test structure to evaluate the impact of neighboring features on stress of metal interconnects

Smith, Brad, Shroff, Mehul

Year:

2014

Language:

english

File:

PDF, 1.31 MB

english, 2014

8

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Model based method for electro-migration stress determination in interconnects

Demircan, Ertugrul, Shroff, Mehul

Year:

2014

Language:

english

File:

PDF, 699 KB

english, 2014

9

Fast Electromigration Immortality Analysis for Multi-Segment Copper Interconnect Wires

Sun, Zeyu, Demircan, Ertugrul, Shroff, Mehul D., Cook, Chase, Tan, Sheldon X.-D.

Journal:

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Year:

2018

Language:

english

File:

PDF, 1.02 MB

english, 2018

10

Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis

Peng, Shaoyi, Demircan, Ertugrul, Shroff, Mehul D., Tan, Sheldon X.-D.

Journal:

Integration, the VLSI Journal

Year:

2019

Language:

english

File:

PDF, 3.05 MB

english, 2019